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Logitech PM5精密研磨拋光系統是帶有一個工作站的臺式機，適用于科學研究水平的研磨和拋光，能夠完成4英寸及以下尺寸樣品的小批量處理。具有加工樣品*性高、規格水平高、表面光潔等特點。 -
The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide. -
The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics -
Chemicals typically used in prime face polishing of semiconductor wafers or electronic and optoelectronic crystals, such as Bromine Methanol or acid etches, are highly aggressive and require ...... -
CMP Tribo 臺式化學機械研磨拋光設備,The Tribo CMP system is a precision engineered, bench top solution designed with one thing in mind - the research of wafer processes, including their associated wafer, pad and slurry interactions. -
Logitech CP3000化學拋光設備能很好的滿足腐蝕拋光溶劑，同樣也適用于腐蝕性較弱的Chemlox拋光，如半導體晶片的背拋光。現在的電子器件對于晶片尺寸，表面平整度、平行度及厚度控制都有非常苛刻的控制要求，而CP3000化學拋光機，特別是跟Logitech的晶片處理系統配合使用作為Z后一個步驟時，能*達到這些控制標準。
